Samsung unveils new GDDR6W memory, promises up to twice the performance and capacity of GDDR6

Samsung unveiled a more moderen GDDR6W reminiscence customary that may ship up to twice the performance, reminiscence capacity, and reminiscence bandwidth as in contrast to the customary GDDR6 and GDDR6X modules.
The better part of these reminiscence modules is that they are often flawlessly utilized in shopper merchandise like graphics playing cards and future consoles as they use the similar ball grid array (BGA) packaging as the older GDDR6 ones. In distinction, HBM2E makes use of a a lot costlier micro pillar grid array (MPGA) packaging.

GDDR6W takes the reminiscence customary nearer to HBM2E, which is a a lot costlier various and is barely utilized in industry-grade merchandise like information server GPUs. With a a lot greater performance output, the altered variant of the VRAM modules will energy next-gen laptop {hardware}.

How do GDDR6W VRAM modules work?
Samsung Announces GDDR6W Graphics Memory:-Doubling The Capacity-Performance With Increased Densities -64-Bit DRAM I/O-Pin Transmission Speed22GbpsSamsung Announces GDDR6W Graphics Memory:-Doubling The Capacity-Performance With Increased Densities -64-Bit DRAM I/O-Pin Transmission Speed22Gbps
The GDDR6W reminiscence module makes use of two DRAM units which successfully doubles the interface from 32 bits to 64 bits. It additionally implies that for the similar die, producers can double the capacity. This improvement means two issues.

First off, units with extra reminiscence capacity could be manufactured with out considerably growing the PCB or die measurement. Thus, future graphics playing cards may include greater than 24 GB of VRAM, in contrast to the RTX 4090.
Secondly, producers can reduce prices on manufacturing units with the similar quantity of VRAM when pitched towards a GDDR6-powered product.
Differences between the packaging of GDDR6 and GDDR6W (Image through Samsung)
The newer reminiscence modules are additionally $36 smaller in measurement thanks to latest enhancements in packaging methods that Samsung aptly calls Fan-Out Wafter-Level Packaging (FOWLP) know-how.

This new method is a breakthrough in the reminiscence {industry} because it will get rid of the conventional PCBs which are typically concerned in connecting VRAM modules. It has been changed with a redistribution layer (RDL), which is a two-layered skinny connecting know-how for the new reminiscence customary. These layers are related to nice copper posts that assist in lowering the die top from 1.1mm to 0.7mm.
However, this subtle packaging method is dearer than inserting the reminiscence chips on a PCB. But the newer chips can be considerably cheaper than the far more costly HBM2E reminiscence requirements that specialists have been contemplating as the subsequent step up in reminiscence module know-how.
The newer reminiscence modules additionally include twice the reminiscence bandwidth. While a 32 GB GDDR6 reminiscence chip has a peak bandwidth of, say, 88 Gbps, the newer modules can ship up to 176 Gbps.
Samsung GDDR6W to present virtually HBM bandwidth whereas being far more cost-efficient.Samsung GDDR6W to present virtually HBM bandwidth whereas being far more cost-efficient.

Samsung is presently utilizing the new reminiscence requirements in industrial functions. They are employed in synthetic intelligence (AI) {hardware} and high-performance computing accelerators.
AMD and Nvidia haven’t introduced the utilization of the new reminiscence modules of their graphics playing cards. However, Samsung has notified that they plan on working with GPU companions to combine GDDR6W reminiscence modules into consumer-grade graphics playing cards.It could be safely assumed that the current-gen RTX 40 sequence and Radeon RX 7000 sequence GPUs won’t get GDDR6W. In that case, will probably be a full two years earlier than these new reminiscence modules begin hitting the PC gaming {hardware} market.

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